Master’s Degree in Telecommunications Engineering + Master’s Degree in Financial Technologies: Payments and Digital Banking
Innovation and Leadership in the Digital Age: Integrating Telecommunications Engineering with FinTech
What can the Master’s degree offer you?
This programme offers the opportunity to immerse yourself in two of the most dynamic and constantly evolving sectors: Telecommunications Engineering, which provides advanced knowledge of communication systems, networks and digital technology, and the Fintech sector, which immerses you in the emerging world of digital payments and online banking.
You will develop the skills to implement telecommunications solutions within the FinTech sector, tackling challenges such as cyber security, data management and the integration of new payment systems, thereby becoming an agent of change in an increasingly digitalised world.
The dual Master’s degree programme in Telecommunications Engineering (MIT) and Financial Technologies: Payments and Digital Banking (MTF) is designed to enable students to develop the skills and competencies of both master’s programmes over two years. The effort required for a dual degree is continuously guided and supported.
Students who complete the programme will be eligible to join the Official Association of Telecommunications Engineers of Spain and practise the legally regulated profession of Telecommunications Engineer.
- CentersIngeniería (Comillas ICAI)
- LanguagesInglés, Español
- CertificationMáster Oficial + Máster Propio
- ModalityPresencial
- Duration2 years (148.5 ECTS)
- Starts On01/09/2027
- Seats30
Si necesitas más información puedes rellenar el siguiente formulario y recibirás información de este programa.
What sets us apart?
Work placements
Hours of supervised work experience at leading companies such as BBVA and NTT Data
Employability
Employment rate among Comillas ICAI graduates
Alumni
Number of alumni registered with Comillas Alumni (in thousands)
Find out about the programme
Curriculum

Study Plan
Master’s Degree in Telecommunications Engineering + Master’s Degree in Financial Technologies: Payments and Digital Banking / MITL+MTFPBD 24
Curriculum 2024
Primer Semestre
Créditos
- Network Services Architecture (MIT - OB)
- Communications Electronics (MIT – OB)
- Security in Communication Systems (MIT – OB)
- Communication Systems I (MIT - OB)
- Decentralised Finance and Blockchain (MIT - OP)
- Fundamentals of Financial Technology, Payments and Digital Banking (MTF - OB)
Segundo Semestre
Créditos
- Optical Communications (MIT - OB)
- Integrated Telecommunications Devices (MIT - OB)
- Electronic Instrumentation (MIT - OB)
- Business Intelligence (MIT – OB)
- Network Planning and Operations (MIT - OB)
- Communication Systems II (MIT - OB)
- Digital Banking Data Analysis (MIT - OP)
- Artificial Intelligence in Banking and Finance (MTF - OB)
Primer Semestre
Créditos
- Industrial Applications of Communications (MIT – OB)
- Project Management (MIT - OB)
- Multimedia Communications (MIT - OB)
- Portfolio Management and Data-Driven Investment (MIT - OP)
- Algorithmic Trading Techniques (MIT - OP)
- Big Data in Banking and Digital Finance (MIT – Open Programme)
Segundo Semestre
Créditos
- Leadership and Change Management (MIT – OB)
- Ethics and CSR (MIT - OB)
- Business Creation, Organisation and Management (MIT - OB)
- Ethics and Regulation in Digital Finance (MTF – OB)
- Payment technologies (MTF – OB)
- Disruptive business models in banking and finance (MTF – OB)
- Work placements (MIT)
Come and get to know us better and discover the full range of academic programmes and the university experience that awaits you.
We can’t wait to meet you!
Information Sessions
Partner Companies
Career prospects
The Master’s Degree in Telecommunications Engineering qualifies graduates for the regulated profession of Telecommunications Engineer, in accordance with current regulations. This dual programme will open up a range of career opportunities:
Digital Banking
Programme Manager
Software Engineer
UX Analyst
Risk Manager
Risk Analyst
"You will master the new financial techniques used to manage businesses in the digital age"
Faculty
Academic External Work Placements
The Master’s program offers the opportunity to undertake work placements at leading companies in the Fintech sector. This experience will enable you to play a direct part at the forefront of innovation within the financial industry, thereby contributing to the development of this sector.
International Experience
Students on this program will be able to undertake international placements as exchange students thanks to the agreements that Comillas ICAI has with some of the most prestigious universities in the United States, Europe and Asia in the field of engineering.
Alumni
Many people just like you are already making the most of their Master’s degree. Find out about their experiences.
Ingeniería (Comillas ICAI)
Pablo Sánchez
It brings students closer to the most innovative projects developed by companies and prepares them to join them.
Ingeniería (Comillas ICAI)
Margarita Sanz
I would define this programme as the ideal complement to my university studies and the best launching pad for a quality job market.
Ingeniería (Comillas ICAI)
Carlos Santamaría
I think that working hand in hand with companies and getting to know how they work in the real world is fundamental when it comes to entering the labour market.
Admissions process
Follow all the steps in our admissions process and become a student at Comillas.
Financial information and scholarships
Full Master’s degree: €41,727
- 10 per cent discount for alumni.
- Paid work placements.
| Course | Total price per course | Registration number | 8 monthly instalments |
|---|---|---|---|
| 1. | €21,074.25 | €3,230.25 | €2,230.50 |
| 2nd | €20,652.77 | €3,165.65 | €2,185.89 |
Information for students
Calendar
View the calendar for the Pontifical University of Comillas
Academic Calendar of the Pontifical University of Comillas
Academic Calendar of the ICAI Higher Technical School of Engineering
ICAI Quotations
Alberto Aguilera, 25
28015 Madrid
The tradition of the Higher Technical School of Engineering (Comillas ICAI) in training engineers began in Madrid in 1908. Today, Comillas ICAI is a polytechnic university whose academic focus is on Industrial and Telecommunications Engineering
Quality and regulations
Official information about the qualification
Informative documentation relating to the official status of the qualification
Monitoring of the degree programme – Composition of the School Board:
Related studies
Frequently Asked Questions
As there is high demand for places at Comillas and places are limited, the best candidates must be selected through entrance examinations.
Each class has a form tutor, whose role is to help students settle into the class and ensure they achieve good academic results. Furthermore, at Comillas, the teaching system is characterised, amongst other things, by personalised support and a close, ongoing relationship between teachers and students.
Comillas’ teaching system is specifically geared towards engaging with the realities of businesses, institutions and organisations, and with professional practice. The Degree Guidance, Work Placements and Employment Service (OPE) is responsible for helping students secure work placements related to their studies in order to enrich their education. In the 2022–23 academic year, 7,101 student work placements in companies were arranged.
The Career Guidance, Work Placements and Employment Service (OPE) is the university service dedicated to providing information, guidance and support to recent graduates as they enter the labour market, and to helping Comillas graduates plan their degree paths; To this end, it offers an online tool that connects candidates directly with 8,302 companies with which Comillas has a relationship. During the 2022–23 academic year, 1,542 job vacancies were processed. Of the total number of graduates from the class of 2021, 92 per cent were in employment or further study within six months of completing their studies.
Get in touch if you need help
Prospective Students’ Office
C/ Alberto Aguilera, 21 - 28015 Madrid
Tel.: (+34) 91 540 61 32
Fax: (+34) 91 559 65 69
futurosalumnos@comillas.edu
Program coordinators
Head of Studies, MIT: Rafael Palacios
MTF Director: Antonio Macías Vecino
MTF Coordinator: Cristóbal Cantos Sánchez de Ibargüen